1. General Educational Disclaimer

The training provided at CH Mobile Institute is designed to equip candidates with advanced micro-soldering, diagnostic, and technical skills. However, successful mastery depends entirely on the candidate's dedication, practice, and comprehension. We do not guarantee employment, specific salary brackets, or business success upon graduation.

2. Risk of Technical Repairs

Modern electronic logic boards are highly complex, pressurized, and layered structures integrated with cryptographic security (like Secure Enclave or Knox). You explicitly acknowledge that:

Inherent Risk: Micro-soldering and thermal operations carry a baseline risk of total device failure. A device submitted in a completely dead state, or requiring CPU/Baseband operations, may not be recoverable.
Manufacturer Warranty: When you submit a device to our independent lab, any remaining official manufacturer warranty (Apple, Samsung, etc.) is immediately voided. We are an independent engineering facility, not an authorized repair center for any specific brand unless explicitly stated.
Water Resistance: Opening modern smartphones permanently compromises their factory IP67/IP68 water and dust resistance. While we reseal devices using professional gaskets, we strictly advise against submerging repaired devices. We are not liable for liquid damagepost-repair.

3. Data Protection Limitation

While we take every professional precaution, we hold absolutely no liability for data loss. Operating on dead motherboards or shorted power lines can result in NAND corruption. Customers are solely responsible for ensuring their data is backed up before delivering devices to our lab.

4. Intellectual Property

The content on https://www.chmobile.institute, including but not limited to custom schematics, thermal imagery, curriculum structure, and training documentation, is the intellectual property of CH Mobile & Institute (Engineer Link). Unauthorized reproduction or commercial distribution of our proprietary methods is strictly prohibited.

1. General Educational Disclaimer

2. Risk of Technical Repairs

Modern electronic logic boards are highly complex, pressurized, and layered structures integrated with cryptographic security (like Secure Enclave or Knox). You explicitly acknowledge that:

Inherent Risk: Micro-soldering and thermal operations carry a baseline risk of total device failure. A device submitted in a completely dead state, or requiring CPU/Baseband operations, may not be recoverable.

Manufacturer Warranty: When you submit a device to our independent lab, any remaining official manufacturer warranty (Apple, Samsung, etc.) is immediately voided. We are an independent engineering facility, not an authorized repair center for any specific brand unless explicitly stated.

Water Resistance: Opening modern smartphones permanently compromises their factory IP67/IP68 water and dust resistance. While we reseal devices using professional gaskets, we strictly advise against submerging repaired devices. We are not liable for liquid damagepost-repair.

4. Intellectual Property